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Substrate processing apparatus and substrate processing method

Imported: 24 Feb '17 | Published: 06 Jan '04

Issei Ueda, Shinichi Hayashi, Naruaki Iida, Yuji Matsuyama, Yoichi Deguchi

USPTO - Utility Patents

Abstract

Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the entire structure of a substrate processing apparatus according to a first embodiment of the present invention;

FIG. 2 is a front view showing the entire structure of the substrate processing apparatus;

FIG. 3 is a rear view showing the entire structure of the substrate processing apparatus;

FIG. 4 is a sectional view of a main wafer transfer section according to the first embodiment of the present invention;

FIG. 5 is a perspective view showing a principal portion of the main wafer transfer section;

FIG. 6 is a side view of the main wafer transfer section;

FIG. 7 is a side view showing a drive mechanism of a main wafer transfer body in the main wafer transfer section;

FIG. 8 is a front view of the main wafer transfer body;

FIG. 9 is a sectional view of the main wafer transfer body;

FIG. 10 is a sectional view taken along the line [

10]-[

10] in FIG. 9;

FIG. 11 is a horizontal sectional view of a pre-baking unit (PAB), a post-exposure baking unit (PEB), or an post-baking unit (POST) according to the first embodiment of the present invention;

FIG. 12 is a vertical sectional view of the aforesaid thermal processing unit;

FIG. 13 is a schematic view showing a temperature regulating mechanism of a casing in the thermal processing unit;

FIG. 14 is a horizontal sectional view of a high-precision temperature regulating unit (CPL)according to the first embodiment of the present invention;

FIG. 15 is a horizontal sectional view of a high-temperature thermal processing unit (BAKE) according to the first embodiment of the present invention;

FIG. 16 is a horizontal sectional view of a transition unit (TRS) according to the first embodiment of the present invention;

FIG. 17 is a plan view showing a resist coating unit according to the first embodiment of the present invention;

FIG. 18 is a vertical sectional view of the resist coating unit;

FIG. 19 is a plan view showing a developing unit according to the first embodiment of the present invention;

FIG. 20 is a vertical sectional view of the developing unit;

FIG. 21 is a flowchart showing a series of operations of the substrate processing apparatus according to the first embodiment of the present invention;

FIG. 22A to FIG. 22C are diagrams for explaining the delivery operation of a substrate in the thermal processing unit;

FIG. 23A to FIG. 23C are operational diagrams of the thermal processing unit;

FIG. 24 is a schematic front view showing the flow of clean air in the substrate processing apparatus according to the first embodiment of the present invention;

FIG. 25 is a schematic side view showing the flow of the clean air;

FIG. 26 is a schematic side view showing the flow of the clean air;

FIG. 27 is a diagram for explaining the opening and closing operation (a first operation) of shutters according to the present invention;

FIG. 28 is a diagram for explaining the opening and closing operation (a second operation) of the shutters according to the present invention;

FIG. 29 is a horizontal sectional view of a thermal processing unit according to a second embodiment of the present invention;

FIG. 30 is a partial plan view of a substrate processing apparatus according to a third embodiment of the present invention;

FIG. 31 is a plan view showing a coating and developing processing system according to a fourth embodiment of the present invention;

FIG. 32 is a front view of the coating and developing processing system shown in FIG. 31;

FIG. 33 is a sectional view when an area having a temperature regulation and heat processing unit group in FIG. 31 is sectioned along an X-direction;

FIG. 34 is a sectional view when an area having temperature regulation processing units in FIG. 31 is sectioned along a Y-direction;

FIG. 35 is a perspective view showing the structure of a transfer device;

FIG. 36 is a plan view showing the structure of a heating and temperature regulation processing unit;

FIG. 37 is a sectional view showing the structure of the heating and temperature regulation processing unit shown in FIG. 36;

FIG. 38 is a sectional view showing the structure of temperature regulating mechanism;

FIG. 39 is a plan view showing a coating and developing processing system according to a fifth embodiment of the present invention;

FIG. 40 is a front view of the coating and developing processing system shown in FIG. 39;

FIG. 41 is a sectional view taken along the line A-A′ in FIG. 39;

FIG. 42 is a plan view showing a coating and developing processing system according to a sixth embodiment of the present invention;

FIG. 43 is a front view of the coating and developing processing system shown in FIG. 42; and

FIG. 44 is a sectional view taken along the line B-B′ in FIG.

42.

Claims

1. A substrate processing apparatus, comprising:

2. The substrate processing apparatus as set forth in claim 1, further comprising:

3. The substrate processing apparatus as set forth in claim 2, further comprising:

4. The substrate processing apparatus, as set forth in claim 2,

5. The substrate processing apparatus as set forth in claim 1,

6. The substrate processing apparatus, as set forth in claim 1,

7. The substrate processing apparatus, as set forth in claim 1, further comprising:

8. A substrate processing apparatus, comprising:

9. The substrate processing apparatus, as set forth in claim 8,

10. The substrate processing apparatus, comprising:

11. The apparatus as set forth in claim 10, further comprising:

12. The apparatus as set forth in claim 11, further comprising:

13. A substrate processing apparatus, comprising:

14. The substrate processing apparatus as set forth in claim 13, further comprising:

15. The substrate processing apparatus as set forth in claim 14,

16. The apparatus as set forth in claim 13,

17. A substrate processing method, comprising the steps of:

18. The substrate processing method as set forth in claim 17, further comprising the step of:

19. A substrate processing apparatus, comprising:

20. The apparatus as set forth in claim 19, further comprising:

21. A substrate processing apparatus, comprising:

22. A substrate processing apparatus, comprising: