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Semiconductor device

Imported: 23 Feb '17 | Published: 22 Oct '02

Yoichiro Kondo

USPTO - Utility Patents

Abstract

To provide a semiconductor device with a three-dimensional mounting module using a flexible circuit substrate which is easy to assemble a three-dimensional structure and is excellent in the workability in repair work (or re-work).

[MEANS FOR SOLUTION] A flexible circuit substrate

11 has mounting regions

111, 112 and

113 on which electronic components

121, 122 and

123 are mainly mounted, respectively, and other electronic components

124 and

125 are also mounted. The flexible circuit substrate

11 is structured in such a manner that the mounting regions

111˜113 are folded on top of the other over the base region

110 in a predetermined order (f

1˜f

3). An integrated spacer

13 has thick regions

131 and thin regions

132, and is superposed and affixed to the flexible circuit substrate

11 as indicated by arrows with broken lines, and supports the electronic components

121˜125 stacked in layers. Fixing bosses

134 and aperture sections

14 to be coupled therewith are provided to facilitate positioning.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a prospective view of a structure of a semiconductor device in accordance with a first embodiment of the present invention.

FIG. 2 shows a perspective view of a characteristic assembling configuration with the structure shown in FIG.

1.

FIG. 3 shows a cross-sectional view of an assembled configuration of the semiconductor device of FIG.

1.

FIGS.

4(

a) and (

b) show a structure of a semiconductor device in accordance with a second embodiment of the present invention, respectively, wherein FIG.

4(

a) shows a plan view before assembly, and FIG.

4(

b) schematically shows a cross-sectional view of a characteristic general structure of a three-dimensional mounting module after assembly.

FIGS.

5(

a) and (

b) show a structure of a semiconductor device in accordance with a third embodiment of the present invention, wherein FIG.

5(

a) shows a plan view before assembly, and FIG.

5(

b) schematically shows a cross-sectional view of a characteristic general structure of a three-dimensional mounting module after assembly.

Claims

1. A semiconductor device comprising:

2. The semiconductor device according to claim 1, wherein the flexible circuit substrate further includes an external terminal region that is continuously provided along a periphery of the base region.

3. The semiconductor device according to claim 1, wherein the flexible circuit substrate further includes an external terminal region that is provided on a surface of the base region on its lower side.

4. The semiconductor device according to claim 1, wherein the stacked layered support has a structure that surrounds a periphery of each of the electronic components with respect to the first region.

5. The semiconductor device according to claim 1, wherein the stacked layered support body has a structure that partially follows along the periphery of each of the electronic components with respect to the first region.

6. The semiconductor device according to claim 1, wherein the base region is further equipped with a structure for mounting the electronic components, which is provided with a thick first region of the stacked layered support body corresponding to each of the electronic components to be mounted on the base region, and aperture sections on the thick first region to be engaged with the protruded sections.

7. The semiconductor device according to claim 1, wherein the electronic components are mounted face down.

8. The semiconductor device according to claim 7, wherein the face down mounting of the electronic components is performed by solder-bonding bump electrodes.

9. The semiconductor device according to claim 1, wherein the flexible circuit substrate is formed from a polyimide.

10. A semiconductor device comprising:

11. A semiconductor device comprising:

12. A method for manufacturing a semiconductor device comprising:

13. The method according to claim 12, further comprising providing an external terminal continuously along a periphery of the base region of the flexible circuit substrate.

14. The method according to claim 12, further comprising providing an external terminal region on a surface of the base region on the lower side of the flexible circuit substrate.

15. The method according to claim 12, further comprising forming the stacked layered support with a structure that surrounds a periphery of each of the electronic components with respect to the first region.

16. The method according to claim 12, further comprising forming the stacked layered support body with a structure that partially follows along the periphery of each of the electronic components with respect to the first region.

17. The method according to claim 12, further comprising providing the base region with a structure for mounting the electronic components, which is provided with a thick first region of the stacked layered support body corresponding to the electronic components to be mounted on the base region, and aperture sections on the thick first region to be engaged with the protruded sections.

18. The method according to claim 12, further comprising mounting the electronic components face down.

19. The method according to claim 18, further comprising solder-bonding bump electrodes to mount the face down electronic components.

20. The method according to claim 12, further comprising forming the flexible circuit substrate out of a polyimide.