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Semiconductor device fabricating equipment using radio frequency energy

Imported: 24 Feb '17 | Published: 13 Jan '04

Jong Hee Kim

USPTO - Utility Patents

Abstract

A semiconductor device fabricating equipment using radio frequency energy is capable of preventing a wafer from being polluted by various kinds of polymers deposited indiscriminately on the respective portions within a chamber, having a housing which divides and forms the inside such that an upper electrode part applying the radio frequency energy is in an upper side thereof, a chuck assembly which applies the radio frequency energy, fixes a provided wafer, and is installed so as to ascend and descend, opposite to the upper electrode part inside the housing, and a baffle plate which is fixingly-installed onto an inner wall of the housing so that an inner side edge portion is positioned adjacent to a side wall of the chuck assembly with a given space therebetween. The baffle plate is fixed and installed onto the inner wall of the housing, and an outer side shape of the ascending/descending-driven chuck assembly is formed simply. Accordingly, the effect of an eddy flow phenomenon caused by the ascending/descending-driving of the chuck assembly is reduced, and a wafer is prevented from being polluted and damaged by controlling a flow of polymer which reacts as a particle on the wafer.

Description

BRIEF DESCRIPTION OF THE ATTACHED DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.

In the drawings: FIG. 1 illustrates a schematic sectional view of the construction of a conventional semiconductor device fabricating equipment using radio frequency energy;

FIG. 2 schematically depicts a partial sectional view of portion II shown in FIG. 1 showing change to a focus ring through a process progression;

FIG. 3 is a schematic sectional view showing the construction of a semiconductor device fabricating equipment using radio frequency energy, in one embodiment of the present invention; and

FIG. 4 represents an enlarged schematic sectional view illustrating the construction of a portion of the semiconductor fabricating equipment shown in FIG. 3 as “IV”.

Claims

1. A semiconductor device fabricating equipment using radio frequency energy, comprising:

2. The equipment of claim 1,

3. The equipment of claim 2, wherein the stepped portion of said insulation ring is formed in a shape closely corresponding to an outer side wall of the focus ring.

4. The equipment of claim 2, wherein an outer side portion of said insulation ring is extendedly formed so as to form a side wall adjacent to an inner side portion of the baffle plate.

5. The equipment of claim 1, wherein the wafer chuck assembly comprises:

6. The equipment of claim 2, wherein said housing includes a ledge between a top and bottom thereof extending from an inner wall of said housing to an interior of said housing, said equipment further comprising a fastener piercing the baffle plate and an upper surface of the ledge, and fixing the baffle plate to the ledge.

7. A semiconductor device fabricating equipment using radio frequency energy, comprising: