Imported: 24 Feb '17 | Published: 13 Jan '04
USPTO - Utility Patents
A semiconductor device fabricating equipment using radio frequency energy is capable of preventing a wafer from being polluted by various kinds of polymers deposited indiscriminately on the respective portions within a chamber, having a housing which divides and forms the inside such that an upper electrode part applying the radio frequency energy is in an upper side thereof, a chuck assembly which applies the radio frequency energy, fixes a provided wafer, and is installed so as to ascend and descend, opposite to the upper electrode part inside the housing, and a baffle plate which is fixingly-installed onto an inner wall of the housing so that an inner side edge portion is positioned adjacent to a side wall of the chuck assembly with a given space therebetween. The baffle plate is fixed and installed onto the inner wall of the housing, and an outer side shape of the ascending/descending-driven chuck assembly is formed simply. Accordingly, the effect of an eddy flow phenomenon caused by the ascending/descending-driving of the chuck assembly is reduced, and a wafer is prevented from being polluted and damaged by controlling a flow of polymer which reacts as a particle on the wafer.
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention.
In the drawings:
1. A semiconductor device fabricating equipment using radio frequency energy, comprising:
2. The equipment of
3. The equipment of
4. The equipment of
5. The equipment of
6. The equipment of
7. A semiconductor device fabricating equipment using radio frequency energy, comprising: