Quantcast

Sample processing system

Imported: 24 Feb '17 | Published: 06 Jan '04

Kazutaka Yanagita, Kazuaki Ohmi, Kiyofumi Sakaguchi

USPTO - Utility Patents

Abstract

This invention is to provide a processing system suitable for manufacturing an SOI substrate. A processing system includes a scalar robot for conveying a bonded substrate stack held by a robot hand, and a centering apparatus, separating apparatus, inverting apparatus, and cleaning/drying apparatus disposed at substantially equidistant positions from a driving shaft of the scalar robot. When the robot hand is pivoted about the driving shaft in the horizontal plane and moved close to or away from the driving shaft, a bonded substrate stack or separated substrate is conveyed among the processing apparatuses.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to

1E are sectional views for explaining the steps in manufacturing an SOI substrate according to a preferred embodiment of the present invention;

FIG. 2 is a plan view showing the schematic arrangement of a processing system according to a first embodiment of the present invention;

FIG. 3 is a flow chart for explaining processing procedures of the processing system for one bonded substrate stack;

FIG. 4 is a view showing an example of processing procedures for parallelly processing a plurality of bonded substrate stacks;

FIG. 5 is a view showing an example of convey processing of a bonded substrate stack or separated substrate by a scalar robot and processing execution procedures of the apparatuses;

FIG. 6 is a schematic view showing the first arrangement of a separating apparatus;

FIG. 7 is a view schematically showing the outer appearance of substrate holding portions shown in FIG. 6;

FIG. 8 is a schematic view showing the second arrangement of the separating apparatus;

FIG. 9 is a view showing part of the separating apparatus shown in FIG. 8;

FIG. 10 is a schematic sectional view showing the third arrangement of the separating apparatus;

FIG. 11 is a schematic sectional view showing the third arrangement of the separating apparatus;

FIG. 12 is a schematic view showing the fourth arrangement of the separating apparatus; and

FIGS. 13A and 13B are views showing another structure of the robot hand of a scalar robot.

FIG. 14 is a plan view showing the schematic arrangement of a processing system according to the second embodiment of the present invention.

FIG. 15 is a plan view showing the schematic arrangement of a processing system according to the third embodiment of the present invention.

FIG. 16 is a view showing an example of convey processing of a bonded substrate stack or separated substrate by the scalar robot and processing execution procedures of the apparatuses.

Claims

1. A processing system for processing a plate shaped sample, comprising:

2. The system according to claim 1, wherein the plate shaped sample has a separation layer, and said separating apparatus separates the plate shaped sample at the separation layer.

3. The system according to claim 2, wherein said separating apparatus ejects a stream of a fluid toward the separation layer to separate the plate shaped sample at the separation layer.

4. The system according to claim 2, wherein said separating apparatus ejects a stream of a fluid toward the separation layer while rotating the plate shaped sample substantially in a horizontal plane to separate the plate shaped sample at the separation layer.

5. The system according to claim 1, wherein said separating apparatus comprises a Bernoulli chuck as a holding mechanism for holding the plate shaped sample.

6. The system according to claim 2, wherein said separating apparatus applies pressure of a fluid substantially standing still to at least part of the separation layer to separate the plate shaped sample at the separation layer.

7. The system according to claim 2, wherein said separating apparatus has a closed vessel, stores the plate shaped sample in the closed vessel, and sets internal pressure of the closed vessel at high pressure to separate the plate shaped sample at the separation layer.

8. The system according to claim 1, wherein said plurality of processing apparatuses include a centering apparatus for centering the plate shaped sample before the plate shaped sample is transferred to said separating apparatus.

9. The system according to claim 1, wherein said plurality of processing apparatuses include a cleaning apparatus for cleaning portions of a plate shaped sample obtained by separation by said separating apparatus.

10. The system according to claim 9, wherein said cleaning apparatus cleans the plate shaped sample obtained by separation by said separating apparatus in the horizontal state.

11. The system according to claim 2, wherein said plurality of processing apparatuses include a cleaning/drying apparatus for cleaning and drying a plate shaped sample obtained by separation by said separating apparatus.

12. The system according to claim 11, wherein said cleaning/drying apparatus cleans and dries the plate shaped sample obtained by separation by said separating apparatus in the horizontal state.

13. The system according to claim 2, wherein processing operations by said plurality of processing apparatuses are parallelly executed.

14. The system according to claim 1, wherein said conveyor mechanism comprises a scalar robot.

15. The system according to claim 1, wherein the plate shaped sample is a semiconductor substrate.

16. The system according to claim 1, wherein the plate shaped sample is formed by bonding a first substrate and a second substrate and has a layer having a fragile structure as a separation layer.

17. A processing system for processing a plate shaped sample, comprising:

18. The system according to claim 17, wherein said plurality of processing apparatuses are disposed at substantially equidistant positions separated from a movable range of the pivot shaft.

19. The system according to claim 17, wherein said conveyor mechanism has a horizontal driving shaft and moves said holding portion along the horizontal driving shaft.

20. The system according to claim 19, wherein some processing apparatuses of said plurality of processing apparatuses are disposed on one side of the horizontal driving shaft on a line substantially parallel to the horizontal driving shaft.

21. The system according to claim 20, wherein remaining processing apparatuses of said plurality of processing apparatuses are disposed on the other side of the horizontal driving shaft on a line substantially parallel to the horizontal driving shaft.

22. The system according to claim 21, wherein some processing apparatuses of said remaining processing apparatuses of said plurality of processing apparatuses are disposed at positions separated from one end and/or the other end of the horizontal driving shaft by a predetermined distance.

23. The system according to claim 21, wherein said processing apparatuses disposed on one side of the horizontal driving shaft comprise a processing apparatus for manipulating the plate shaped sample or physically or chemically processing the plate shaped sample, and said processing apparatuses disposed on the other side of the horizontal driving shaft comprise a loader or unloader for handling the plate shaped sample.

24. The system according to claim 22, wherein said processing apparatuses disposed on one side of the horizontal driving shaft and processing apparatuses disposed at one end and/or the other end of the horizontal driving shaft comprise processing apparatuses for manipulating the plate shaped sample or physically or chemically processing the plate shaped sample, and said processing apparatuses disposed on the other side of the horizontal driving shaft comprise loaders or unloaders for handling the plate shaped sample.

25. The system according to claim 17, wherein the plate shaped sample has a separation layer, and said separating apparatus separates the plate shaped sample at the separation layer.

26. The system according to claim 25, wherein said separating apparatus ejects a stream of a fluid to the separation layer to separate the plate shaped sample at the separation layer.

27. The system according to claim 25, wherein said separating apparatus ejects a stream of a fluid to the separation layer while rotating the plate shaped sample to separate the plate shaped sample at the separation layer.

28. The system according to claim 17, wherein said separating apparatus has a Bernoulli chuck as a holding mechanism for holding the plate shaped sample.

29. The system according to claim 25, wherein said separating apparatus applies pressure of a fluid which is substantially standing still to at least part of the separation layer of the plate shaped sample to separate the plate shaped sample at the separation layer.

30. The system according to claim 25, wherein said separating apparatus has a closed vessel, the plate shaped sample is stored in the closed vessel, and pressure in the closed vessel is increased to separate the plate shaped sample at the separation layer.

31. The system according to claim 17, wherein said plurality of processing apparatuses include a centering apparatus for centering the plate shaped sample before the plate shaped sample is transferred to said separating apparatus.

32. The system according to claim 17, wherein said plurality of processing apparatuses include a cleaning apparatus for cleaning a plate shaped sample obtained by separation by said separating apparatus.

33. The system according to claim 32, wherein said cleaning apparatus cleans the plate shaped sample obtained by separation by said separating apparatus in a horizontal state.

34. The system according to claim 17, wherein said plurality of processing apparatuses include a cleaning/drying apparatus for cleaning and drying the plate shaped sample obtained by separation by said separating apparatus.

35. The system according to claim 34, wherein said cleaning/drying apparatus cleans and dries the plate shaped sample obtained by separation by said separating apparatus in a horizontal state.

36. The system according to claim 17, wherein said plurality of processing apparatuses parallelly execute processing.

37. The system according to claim 17, wherein said conveyor mechanism comprises a scalar robot and a driving mechanism for linearly driving said scalar robot in the horizontal plane.

38. The system according to claim 17, wherein the plate shaped sample is a semiconductor substrate.

39. The system according to claim 17, wherein the plate shaped sample is formed by bonding a first substrate and a second substrate and has a layer having a fragile structure as a separation layer.

40. A processing system for processing a plate shaped sample, comprising: