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Reliable fabrication method of transferable micron scale metal pattern for poly(dimethylsiloxane) metallization.

Research paper by Kwan Seop KS Lim, Woo-Jin WJ Chang, Yoon-Mo YM Koo, Rashid R Bashir

Indexed on: 31 Mar '06Published on: 31 Mar '06Published in: Lab on a Chip



Abstract

We have developed a reliable fabrication method of forming micron scale metal patterns on poly(dimethylsiloxane) (PDMS) using a pattern transfer process. A metal stack layer consisting of Au-Ti-Au layers, providing a weak but reliable adhesion, was deposited on a silicon wafer. The metal stack layer was then transferred to a PDMS substrate using serial and selective etching. We demonstrate that features as small as 2 microm were reliably transferred on to the PDMS substrate for use as interconnects and electrodes for biosensors and flexible electronics application.