Indexed on: 01 Mar '07Published on: 01 Mar '07Published in: Frontiers of Chemistry in China
Thin-layer electrochemical studies of the underpotential deposition (UPD) of Bi and Te on cold rolled silver substrate have been performed. The voltammetric analysis of underpotential shift demonstrates that the initial Te UPD on Bi-covered Ag and Bi UPD on Te-covered Ag fitted UPD dynamics mechanism. A thin film of bismuth telluride was formed by alternately depositing Te and Bi via an automated flow deposition system. X-ray diffraction indicated the deposits of Bi2Te3. Energy Dispersive X-ray Detector quantitative analysis gave a 2: 3 stoichiometric ratio of Bi to Te, which was consistent with X-ray Diffraction results. Electron probe microanalysis of the deposits showed a network structure that results from the surface defects of the cold rolled Ag substrate and the lattice mismatch between substrate and deposit.