Oxidized bridges technology for suspended MEMS fabrication using standard silicon wafer

Research paper by A. Postnikov, O. V. Morozov, I. I. Amirov

Indexed on: 31 Jan '14Published on: 31 Jan '14Published in: Microsystem Technologies


This paper presents a new method for electrically isolating released single crystal silicon MEMS structures. The technology employees double-side processing deep reactive ion etching to obtain functional high aspect ratio micromechanical structures and deep silicon oxidizing to isolate them from bulk silicon. Applicability of the technology to MEMS design was demonstrated with fabrication of the monolithic integrated bulk micromachined comb drive.