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Matched thermal expansion carrier tape assemblage for semiconductor devices

Imported: 23 Feb '17 | Published: 22 Oct '02

Michael L. Hayden, Clessie A. Troxtell, Jr.

USPTO - Utility Patents

Abstract

A carrier and cover tape assemblage for semiconductor devices which maintains integrity through bake temperature of 125 degrees C is provided by cover and carrier tapes of the same material, such as polycarbonate, and thus having the same thermal properties so that the joining adhesive is placed under minimal stress to cause delamination or distortion.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates tape and reel carrier format for integrated circuits. (Prior art)

FIG. 2 illustrates the effect of thermal expansion mismatch between two materials laminated together.

FIG. 3 is a plan view of carrier tape with adhesive and cover tape.

FIG. 4

a is a view of the carrier with an array of recesses, and a cover tape.

FIG. 4

b is a cross section through a carrier recess with an adhered cover tape.

Claims

1. An assemblage for holding, transporting and baking semiconductor devices including the following;

2. An assemblage as in claim 1 wherein said carrier and cover tapes have heat deflection temperature greater than 125 degrees C.

3. An assemblage as in claim 1 said carrier tape and said cover tape comprise polycarbonate resin.

4. An assemblage as in claim 1 wherein said cover tape is in the range of 0.05 to 0.10 mm thickness.

5. An assemblage as in claim 1 wherein said adhesive is a pressure sensitive adhesive.

6. An assemblage as in claim 1 wherein said assemblage is dimensionally stable at 125 degrees C.

7. An assemblage as in claim 1 having thermal characteristics equal to those of a transport reel onto which said assemblage is wound.

8. An assemblage as in claim 1 wherein said semiconductor devices are leaded plastic molded surface devices.

9. An assemblage as in claim 1 wherein said semiconductor devices are ball grid array (BGA) devices.

10. An assemblage as in claim 1 wherein said semiconductor devices are chip scale packages (CSP).

11. A tape assemblage for holding, transporting and baking semiconductor devices including the following;