Liquid epoxy resin composition and semiconductor device

A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a schematic view of a flip chip-type semiconductor device according to one embodiment of the invention.

1. A liquid epoxy resin composition comprising

wherein R

1 is hydrogen or a monovalent hydrocarbon group of 1 to 20 carbon atoms and n is an integer of 1 to 4,

H

aR

bSiO

(4−a−b)/2  (1)

wherein R is a substituted or unsubstituted monovalent hydrocarbon group, “a” is a number of 0.01 to 0.1, “b” is a number of 1.8 to 2.2, and a+b is from 1.81 to 2.3, having 20 to 400 silicon atoms per molecule, the number of hydrogen atoms directly bonded to silicon atoms (SiH groups) being 1 to 5, the copolymer resulting from addition reaction of alkenyl groups on the epoxy or phenolic resin with SiH groups on the organopolysiloxane,

2. The composition off claim 1 wherein the curing agent (B) includes 25 to 100% by weight of a resin of the following general formula (3):

wherein R

2 is a monovalent hydrocarbon group of up to 10 carbon atoms having a double bond, and R

2 is selected from divalent hydrocarbon groups of the following formulae:

wherein R

4 is hydrogen or a monovalent hydrocarbon group of up to 10 carbon atoms.

3. The composition of claim 1 wherein the curing accelerator (C) is an imidazole compound or organophosphorus compound.

4. The composition of claim 1 wherein the curing accelerator (C) is comprised of microcapsules containing an imidazole compound or organophosphorus compound therein and having an average particle size of 0.5 to 10 m, the quantity of the imidazole compound or organophosphorus compound leached out from the microcapsules in o-cresol at 30° C. for 15 minutes being at least 70% by weight of the entire compound quantity in the microcapsules.

5. A semiconductor device which is sealed with the liquid epoxy resin composition of claim 1 in the cured state.

6. A flip chip type semiconductor device which is sealed with the liquid epoxy resin composition of claim 1 in the cured state.

7. The composition of claim 1 wherein the epoxy resin comprises from about 25 to about 100 percent by weight of the composition.

8. The composition of claim 1 wherein the epoxy resin has a total chlorine content of not more than 1,500 ppm.

9. The composition of claim 1 wherein the inorganic filler is selected from the group consisting of: fused silica, crystalline silica, aluminum, alumina, aluminum nitride, boron nitride, silicon nitride, magnesia and magnesium silicate.

10. The composition of claim 1 wherein the inorganic filler has a maximum particle size of 75 m.

11. The composition of claim 1 wherein the amount of the filler included in the composition is in a range of 100 to 600 parts by weight per 100 parts by weight of the combined weight of the liquid epoxy resin (A), plus the curing agent (B) and the modified silicone resin (E).