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Laminated mold for spacer assembly of a flat panel display

Imported: 24 Feb '17 | Published: 06 Jan '04

Shigeo Takenaka, Kumio Fukuda, Masaru Nikaido, Satoshi Ishikwa

USPTO - Utility Patents

Abstract

A spacer assembly has first and second spacers standing on first and second surfaces of a plate-like grid to be integral with them. First and second molds each with a plurality of through holes are arranged on the first and second surfaces of the grid to be in tight contact with them. After that, the through holes of the molds are filled with a glass paste containing an ultraviolet-curing binder, and the glass paste is cured by irradiation with ultraviolet rays. Furthermore, while the molds are held in a tight contact state, the glass paste is calcined at a predetermined temperature. Thus, the first and second spacers are integrally formed on the grid surfaces.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate an embodiment of the invention, and together with the general description given above and the detailed description of the embodiment given below, serve to explain the principles of the invention.

FIG. 1 is a perspective view showing a surface conduction type electron-emitting apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view of the surface conduction type electron-emitting apparatus taken along the line II—II of FIG. 1;

FIG. 3 is an enlarged sectional view of the surface conduction type electron-emitting apparatus;

FIG. 4 is an exploded perspective view showing a grid and first and second molds used in the manufacture of a spacer assembly in the surface conduction type electron-emitting apparatus;

FIG. 5 is an enlarged sectional view of part of the first mold;

FIGS. 6A to

6C are sectional views respectively showing the steps in manufacturing the spacer assembly;

FIGS. 7A and 7B are sectional views respectively showing the steps in manufacturing the spacer assembly;

FIG. 8 is a sectional view of a surface conduction type electron-emitting apparatus with a spacer assembly according to the second embodiment of the present invention;

FIGS. 9A and 9B are sectional views respectively showing the steps in manufacturing the spacer assembly according to the second embodiment;

FIGS. 10A to

10C are sectional views respectively showing the steps in manufacturing the spacer assembly according to the second embodiment;

FIG. 11 is an exploded sectional view of a surface conduction type electron-emitting apparatus with a spacer assembly according to the third embodiment of the present invention;

FIG. 12 is a sectional view showing an SED according to the fourth embodiment of the present invention;

FIG. 13 is a schematic plan view of the first and second spacers of the SED according to the fourth embodiment which are seen from the second spacer side;

FIG. 14 is a schematic perspective view showing part of the spacer assembly of the SED according to the fourth embodiment;

FIGS. 15A to

15C are sectional views respectively showing the steps in manufacturing the spacer assembly; and

FIGS. 16A and 16B are sectional views respectively showing the steps in manufacturing the spacer assembly.

Claims

1. A mold used in a method of manufacturing a spacer assembly having a substrate and a plurality of columnar spacers formed on the substrate and used in a flat panel display apparatus, the method comprising preparing a substrate and a mold having a plurality of stepped tapered through holes each with a diameter that decreases gradually from one end toward the other end thereof; arranging the mold on a surface of the substrate to be in tight contact therewith such that large-diameter sides of the through holes are located on a substrate side; and filling the through holes of the mold with a spacer forming material,

2. The mold according to claim 1, wherein the plurality of metal thin plates are bonded to each other.

3. The mold according to claim 2, wherein the plurality of metal thin plates are bonded by one of diffusion bonding, brazing, and ultrasonic bonding.

4. The mold according to claim 1, which further comprises a surface layer covering an outer surface of the mold and inner surfaces of the through holes, the surface layer having releasability with respect to the spacer forming material and oxidation resistance.

5. The mold according to claim 1, wherein each of the metal thin plates has a thickness of 0.1 mm to 0.3 mm.

6. The mold according to claim 1, wherein the stacked metal thin plates have a thickness of 0.3 mm to 1.2 mm as a whole.

7. The mold according to claim 1, wherein each of the through holes of each of the metal thin plates is a tapered through hole.