Integrated circuit packages

An integrated circuit package is mounted on a socket pedestal. External terminals such as ball electrodes may be provided in an array on a mounting surface. Recessed sections can also be provided in the mounting surface in a peripheral section of a region where the external terminals are arranged. The recessed sections can be used for positioning. When the integrated circuit package is subject to an electrical characteristic test (or a burn-in test), the recessed sections can be coupled to protrusions provided on a side of a socket and positioned. As a result, the external terminals can be securely and accurately connected to socket terminals. Thus, integrated circuit packages are provided which have arrayed electrodes for face-down mounting, and which improves the connection accuracy with respect to a socket for conducting electrical characteristic tests.

BRIEF DESCRIPTION OF DRAWINGS

FIGS.

1(

a) and (

b) respectively show general views of main sections of integrated circuit packages in accordance with a preferred aspect of the present invention.

FIG.

2(

a) shows a plan view and FIG.

2(

b) shows a side view of one example of a mounting surface of an integrated circuit package of BGA type (or CSP type) in accordance with the preferred aspect of the present invention shown in FIG.

1(

a) and (

b), respectively.

FIG. 3 schematically shows an example of a conventional integrated circuit package.

1. An integrated circuit package, comprising:

2. An integrated circuit package according to claim 1, wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.

3. An integrated circuit package according to claim 1, further comprising:

4. An integrated circuit package according to claim 1, wherein each of the recessed sections is convex-shaped.

5. An integrated circuit package according to claim 1, wherein the integrated circuit package is a ball-grid-array type integrated circuit package.

6. An integrated circuit package according to claim 1, wherein the integrated circuit package is a chip-size-package type integrated circuit package.

7. An integrated circuit package, comprising:

8. An integrated circuit package according to claim 7, wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.

9. An integrated circuit package according to claim 7, further comprising:

10. An integrated circuit package according to claim 7, wherein each of the recessed sections is convex-shaped.

11. An integrated circuit package according to claim 7, wherein the integrated circuit package is a ball-grid-array type integrated circuit package.

12. An integrated circuit package according to claim 7, wherein the integrated circuit package is a chip-size-package type integrated circuit package.

13. An integrated circuit package according to claim 7, wherein the recessed sections are disposed along the mounting surface in a peripheral region of the external terminals.

14. An integrated circuit package, comprising:

15. An integrated circuit package according to claim 14, wherein the array of external integrated circuit terminals are disposed on a mounting surface of the integrated circuit package, and wherein the recessed sections are disposed along the mounting surface in a peripheral region of the external terminals.

16. An integrated circuit package according to claim 15, wherein the recessed sections are provided diagonally on the mounting surface with respect to each other.

17. An integrated circuit package according to claim 14, further comprising:

18. An integrated circuit package according to claim 14, wherein each of the recessed sections is convex-shaped.

19. An integrated circuit package according to claim 14, wherein the integrated circuit package is a ball-grid-array type integrated circuit package.

20. An integrated circuit package according to claim 14, wherein the integrated circuit package is a chip-size-package type integrated circuit package.