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High-frequency interconnection for circuits

Imported: 23 Feb '17 | Published: 22 Oct '02

River Guanghua Huang, Parker Chandler

USPTO - Utility Patents

Abstract

An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Throughout the several views of the drawings one possible embodiment of the invention is shown wherein:

FIG. 1 is a cross section view of a package using aspects of the invention;

FIG. 2 is a plan view of a package using certain aspects of the invention;

FIG. 3 is a graph showing reflection coefficient test results taken for prototype packages;

FIG. 4 is a graph showing insertion loss test results taken for prototype packages; and

FIG. 5 is a graph showing performance of a package using laminate substrates.

Claims

1. A method of interconnecting a first pad to a second pad, the method comprising:

2. The method of claim 1 wherein providing a wire between a first pad and a second pad includes:

3. The method of claim 2 wherein providing a wire includes:

4. The method of claim 1 wherein providing a capacitor includes:

5. The method of claim 4 wherein shunting the signal path with the capacitor includes:

6. The method of claim 5 wherein providing a capacitor includes:

7. The method of claim 5 wherein providing a capacitor includes:

8. The method of claim 1 wherein providing a capacitor, thereby tuning the portion of the signal path formed by the wire includes:

9. The method of claim 1 wherein providing a capacitor, thereby tuning the portion of the signal path formed by the wire includes:

10. A method of interconnecting a first pad to a second pad, the method comprising:

11. An apparatus for connecting a first portion of an electrical circuit to a second portion of an electrical circuit, the apparatus comprising:

12. The apparatus of claim 11 wherein:

13. The apparatus of claim 11 wherein the bonds between the first end of the wire and the first bonding pad and the second end of the wire and second bonding pad are selected from the group consisting essentially of a ball bond and a wedge bond.

14. The apparatus of claim 13 wherein the wire has a round cross-section.

15. The apparatus of claim 11 wherein the capacitor shunts to ground the portion of the signal path formed by the wire.

16. The apparatus of claim 11 further comprising a substrate, a bonding pad mounted on the substrate, and a ground positioned proximal to the bonding pad thereby forming a capacitor, at least one end of the wire being bonded to the bonding pad.

17. The apparatus of claim 11 further comprising a dielectric substrate, a bonding pad on one side of the dielectric substrate, and a ground plane on an opposite side of the dielectric substrate, the dielectric substrate, the bonding pad, and the ground plane forming the capacitor.

18. The apparatus of claim 11 wherein the impedance of the wire substantially matches the impedance of the first and second portions of the electrical circuit at one or more predetermined frequencies.

19. The apparatus of claim 18 wherein the wire has a reflection coefficient of less than −15 dB for at least one predetermined frequency at or above about 20 GHz.

20. The apparatus of claim 18 wherein the wire has a reflection coefficient of less than −15 dB for at least one predetermined frequency at or above about 30 GHz.

21. An apparatus for connecting a first portion of an electrical circuit to a second portion of an electrical circuit, the apparatus comprising: