Heat dissipation device for a computer

The present invention relates to a heat dissipation device for a computer, more particularly relates to a heat dissipation device having a mounting structure for readily mounting a heat dissipation device onto a computer case or printed circuit board in order to draw out the heat generated by semiconductor devices of the computer, wherein the heat dissipation device may be mounted onto a plate of the computer case by fastening members and elastic members, in addition, the heat dissipation device may directly be mounted onto a printed circuit board and connected a heat sink and a semiconductor device to the printed circuit board for cooling the semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an exploded view of mounting a heat dissipation device, a heat sink and a semiconductor device onto the printed circuit board.

FIG. 2 shows a assembled view of FIG.

1.

FIG. 3 shows an exploded view of mounting a heat dissipation device onto a plate of computer case.

1. A heat dissipation device for a computer, comprising:

2. A heat dissipation device according to claim 1, wherein on the exterior of said support plate in the opposite position having a pair of extensive downwardly sleeve with a through hole.

3. A heat dissipation device according to claim 1, wherein said elastic member is a spring.

4. A heat dissipation device according to claim 1, the heat dissipation device is placed on a heat sink over a semiconductor device and mounted onto the printed circuit board and is employed for cooling a heat sink over a semiconductor device.

5. A heat dissipation device according to claim 1, the heat dissipation device is mounted onto a plate of the computer case and is employed for drawing out hot air inside computer case.