Imported: 23 Feb '17 | Published: 24 Dec '02
USPTO - Utility Patents
The present invention relates to a heat dissipation device for a computer, more particularly relates to a heat dissipation device having a mounting structure for readily mounting a heat dissipation device onto a computer case or printed circuit board in order to draw out the heat generated by semiconductor devices of the computer, wherein the heat dissipation device may be mounted onto a plate of the computer case by fastening members and elastic members, in addition, the heat dissipation device may directly be mounted onto a printed circuit board and connected a heat sink and a semiconductor device to the printed circuit board for cooling the semiconductor device.
1. A heat dissipation device for a computer, comprising:
2. A heat dissipation device according to
3. A heat dissipation device according to
4. A heat dissipation device according to
5. A heat dissipation device according to