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Forming viaholes in composition of cyanate, bismaleimide, epoxy resin and unsaturated aromatic glycidyl

Imported: 24 Feb '17 | Published: 09 Sep '03

Miguel Albert Capote, Edward S. Harrison, Yong-Joon Lee, Howard A. Lenos

USPTO - Utility Patents

Abstract

A process of forming vias in a composition comprising

(a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R

1—Ar—R

2 wherein Ar is at least one aryl moiety, R

1 is at least one unsaturated aliphatic moiety and R

2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator;

(b) covering the layer with a mask having windows through which radiation can be transmitted;

(c) exposing part of the composition to radiation to at least partially cure it in the exposed areas;

(d) removing the non-cured portions of the composition; and

(e) completing the cure of the resin compositions.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 are tan delta dynamic mechanical analyzer (DMA) scans from two resin mixtures showing the glass transition temperatures of two test resin mixes, one with and one without the co-curing agent APGE;

FIG. 2 is the thermogravimetric scans for a cyanate ester-bismaleimide-epoxy resin mixture with APGE;

FIG. 3 are thermal decomposition weight loss scans for (i) resins having APGE (ii) resins having DADE, and (iii) FR-4 epoxy laminate;

FIG. 4 is the DMA scan of an inventive resin composition;

FIG. 5 is the DMA scan of an inventive resin composition;

FIG. 6 is the thermal mechanical analyzer scan of same inventive resin composition of FIG. 5;

FIG. 7 are differential scanning calorimetry scans of bismaleimide-co-curing agent mixtures with and without a free-radical initiator;

FIGS. 8,

9, and

10 illustrate encapsulation of an electronic device with a resin composition; and

FIGS. 11,

12, and

13 illustrate encapsulation of a printed circuit board with a resin composition.

Claims

1. A process of forming vias in a polymer composition comprising the steps of:

2. The process of claim 1 wherein the co-curing agent is selected from the group consisting of compounds having the structures I and II:

wherein each of R

3 and R

4 are each selected from H, —CH

3 or CF

3 and mixtures thereof.

3. The process of claim 1 wherein the co-curing agent is selected from the group consisting of 2-allyphenyl glycidyl ether, 2,2′-diallybisphenol A diglycidyl ether, and mixtures thereof.

4. The process of claim 1 the cyanate ester is selected from the group consisting of compounds having the structures I, II and III:

wherein X is a divalent moiety, and mixtures thereof.

5. The process of claim 1 wherein the cyanate ester is

wherein n is an integer from 0 to 200.

6. The process of claim 1 wherein the resin composition does not include a solvent.

7. The process of claim 1 wherein the epoxy resin is selected from the group consisting of bisphenol A based epoxy resin, bisphenol F based epoxy resin, epoxy novolac, epoxy cresol novolac, triphenylomethane triglycidyl ether, N,N-diglycidyl-4-glycidyloxyaniline, and 4,4′-methylenebis(N,N-diglycidylaniline).

8. The process of claim 1 wherein the resin composition comprises a heat triggered initiator.

9. The process of claim 1 further comprising a cyanate ester trimerization catalyst.

10. The process of claim 1 wherein the cyanate ester comprises about 1.5 to 5 molar equivalent parts of the composition, the bismaleimide comprises about 0.5 to 1.5 molar equivalent parts of the composition, the co-curing agent comprises about 0.5 to 1.5 molar equivalents of the composition, and the epoxy resin comprising about 1.5 to 5 molar equivalent parts of the composition.

11. The process of claim 1 wherein the epoxide molar equivalent concentration in the resin composition is equal to or less than the cyanate ester molar concentration.

12. The process of claim 1 wherein the co-curing agent molar equivalent concentration is less than the lesser of either (i) the cyanate ester molar concentration or (ii) the bismaleimide molar concentration.

13. A process of forming vias in a polymer composition comprising the steps of:

14. The process of claim 13 wherein the co-curing agent is selected from the group consisting of compounds having the structures I and II:

wherein each of R

3 and R

4 are each selected from H, —CH

3 or CF

3 and mixtures thereof.

15. The process of claim 13 wherein the co-curing agent is selected from the group consisting of 2-alyphenyl glycidyl ether, 2,2′-diallybisphenol A diglycidyl ether, and mixtures thereof.

16. The process of claim 13 the cyanate ester is selected from the group consisting of compounds having the structures I, II and III:

wherein X is a divalent moiety, and mixtures thereof.

17. The process of claim 13 wherein the cyanate ester is

wherein n is an integer from 0 to 200.

18. The process of claim 13 herein the resin composition does not include a solvent.

19. The process of claim 13 wherein the epoxy resin is selected from the group consisting of bisphenol A based epoxy resin, bisphenol F based epoxy resin, epoxy novolac, epoxy cresol novolac, triphenylomethane triglycidyl ether, N,N-diglycidyl-4-glycidyloxyaniline, and 4,4′-methylenebis(N,N-diglycidylaniline).

20. The process of claim 13 wherein the resin composition comprises the free radical initiator which is a heat triggered initiator.

21. The process of claim 13 further comprising a cyanate ester trimerization catalyst.

22. The process of claim 13 wherein the cyanate ester comprises about 1.5 to 5 molar equivalent parts of the composition, the bismaleimide comprises about 0.5 to 1.5 molar equivalent parts of the composition, the co-curing agent comprises about 0.5 to 1.5 molar equivalents of the composition, and the epoxy resin comprising about 1.5 to 5 molar equivalent parts of the composition.

23. The process of claim 13 wherein the epoxide molar equivalent concentration in the resin composition is equal to or less than the cyanate ester molar concentration.

24. The process of claim 13 wherein the co-curing agent molar equivalent concentration is less than the lesser of either (i) the cyanate ester molar concentration or (ii) the bismaleimide molar concentration.