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Fixed abrasive polishing pad

Imported: 24 Feb '17 | Published: 06 Jan '04

Michael A. Walker, Karl M. Robinson

USPTO - Utility Patents

Abstract

Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished. Preferably, a portion of the second member can be removed from the polishing pad so that the first polishing surface extends beyond the second polishing surface to provide for a fixed amount of abrasion using the first member prior to the second member contacting the surface and substantially reducing or stopping the polishing process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the present invention will be described in greater detail with reference to the accompanying drawings, wherein like members bear like reference numerals and wherein:

FIG. 1 is a side view of an apparatus of the present invention;

FIG. 2 is a top cross sectional view of an apparatus along the line II—II of FIG. 1;

FIG. 3 is a cross section of a preferred embodiment of the present invention prior to polishing the surface of a wafer;

FIG. 4 is a cross section of a preferred embodiment of the present invention following the polishing the surface of a wafer; and,

FIG. 5 is a cross section of an alternative preferred embodiment of the present invention prior to polishing the surface of a wafer.

Claims

1. A polishing pad for polishing a surface, comprising:

2. The pad of claim 1, further comprising an opposing side formed from at least one of the first member and the second member.

3. The pad of claim 1, wherein:

4. The pad of claim 3, wherein the plurality of first and second sections are provided in an alternating arrangement.

5. The pad of claim 1, wherein the first material comprises a matrix material containing the larger and the smaller particles, the larger and the smaller particles being more abrasive than the matrix.

6. The pad of claim 5, wherein the matrix material is substantially nonabrasive.

7. The pad of claim 5, wherein the matrix material is abrasive.

8. The pad of claim 1, wherein the second material is substantially nonabrasive.

9. The pad of claim 1, wherein the second material is substantially nondegradable.

10. A polishing pad for polishing a surface, comprising:

11. The pad of claim 10, wherein:

12. The pad of claim

11, wherein the plurality of first and second sections are provided in an alternating arrangement.

13. The pad of claim 10, wherein:

14. A polishing pad for polishing a surface, comprising:

15. The pad of claim 14, further comprising an opposing side formed from at least one of the first member and the second member.

16. The pad of claim 14, wherein:

17. The pad of claim 16, wherein the plurality of first and second sections are provided in an alternating arrangement.

18. The pad of claim 14, wherein the second member includes a second material is more soluble in a solvent than the first material.

19. The pad of claim 14, wherein the second material is substantially nonabrasive.

20. The pad of claim 19, wherein the second material is substantially nondegradable.