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Electronic apparatus having a heat dissipation member

Imported: 23 Feb '17 | Published: 22 Oct '02

Akira Ueda, Masumi Suzuki, Minoru Hirano

USPTO - Utility Patents

Abstract

The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects of the present invention will become apparent from the following detailed description of the preferred embodiment of the invention, taken in connection with the accompanying drawings.

In the drawings:

FIG. 1A is a cross-sectional view, and FIG. 1B is a see-through view of a first embodiment of a heat dissipation structure for a notebook type computer according to the invention;

FIG. 2A is a perspective view of a first example, and FIG. 2B is a perspective view of a second example, of a heat radiation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 3 is a cross-sectional view of a second embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 4A is a cross-sectional view, FIG. 4B is a perspective view, and FIG. 4C is a cross-sectional view, of a third embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 5A is a perspective view, and FIG. 5B is a cross-sectional view, of a third example of a heat radiation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 6 is a perspective view of a fourth example of a heat radiation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 7 is a perspective view of a fifth example of a heat radiation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 8 is a cross-sectional perspective view of a sixth example of a heat radiation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 9 is a cross-sectional view of a fourth embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 10 is a view of a seventh example of a heat radiation plate used in the fourth embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 11 is a view of a pipe used as the seventh example of the heat dissipation plate in the heat dissipation structure for a notebook type computer according to the present invention;

FIG. 12 is a view of an eighth example of a heat dissipation plate used in the heat dissipation structure for a notebook type computer according to the present invention described with reference to FIG. 10;

FIG. 13 is a view of a ninth example of a heat dissipation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 14 is a view of a tenth example of a heat dissipation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 15 is a view of an eleventh example of a heat dissipation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 16 is a view of a twelfth example of a heat dissipation plate used in a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 17A is a cross-sectional partial view, and FIG. 17B is a perspective view, of a fifth embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 18 is a cross-sectional view of a main part of a sixth embodiment of a heat dissipation structure for a notebook type computer according to the present invention;

FIG. 19A is a perspective view, and FIG. 19B cross-sectional view, of a thirteenth example of a heat dissipation plate used in a heat dissipation structure for a notebook type computer according to the present invention; and

FIG. 20A is a perspective view, and FIG. 20B is a cross-sectional view, of a prior art notebook type computer.

Claims

1. A heat dissipation structure for a notebook type computer, comprising:

2. The heat dissipation structure according to claim 1, further comprising:

3. The heat dissipation structure according to claim 1, wherein:

4. The heat dissipation structure according to claim 1, wherein:

5. The heat dissipation structure according to claim 4, wherein the heat dissipation member comprises vertically oriented and parallel, spaced heat dissipating fins mounted on and extending from an upper surface of the second end of the cavity member.

6. A heat dissipation structure in a housing of an electronic apparatus, the housing having spaced main surfaces extending in generally parallel, lateral directions and at least first and second sidewalls extending between the spaced main surfaces and together therewith defining an interior of the housing, the electronic apparatus having a heat producing element disposed at least in part within a first interior portion of the housing and, in operation, producing heat and discharging at least a part of the heat into the first interior portion of the housing, the heat dissipation structure comprising:

7. The heat dissipation structure according to claim 6, wherein a bottom surface of the cavity member is disposed at an upward angle relatively to the generally horizontal, use position of the notebook type computer, from the first end and to the second end thereof, the vapor losing heat by heat transfer to the heat dissipation member and returning to a liquid at the second end and flowing by gravity to the first end thereof.

8. The heat dissipation structure according to claim 6, further comprising:

9. The heat dissipation structure according to claim 6, wherein the heat dissipation member is oriented substantially transversely with respect to a direction between the first and second ends of the cavity member.

10. The heat dissipation structure according to claim 9, wherein the heat dissipation member comprises vertically oriented and parallel, spaced heat dissipating fins mounted on and extending from an upper surface of the second end of the cavity member.