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Effects of Different Kinds of Underfills and Temperature–Humidity Treatments on Drop Reliability of Board-Level Packages

Research paper by Bo-In Noh, Jeong-Won Yoon, Sang-Ok Ha, Seung-Boo Jung

Indexed on: 25 Nov '10Published on: 25 Nov '10Published in: Journal of Electronic Materials



Abstract

The hygrothermal and mechanical reliability of board-level packages with various underfills under sequential temperature and humidity (TH) testing and drop testing were investigated. Board-level packages with underfill had greater resistance to drop shock than that without underfill, indicating that underfill protects the package from failure by absorption of the applied drop shock. The underfill, which was composed of polypropylene glycol epoxy resin and silane, exhibited good reliability for drop shock because of the improved adhesion of the underfill compared with that without the polypropylene glycol epoxy resin and silane. In addition, the drop reliability of board-level packages with underfill decreased with increasing TH test duration. Adhesion between the substrate and underfill or between the solder and underfill was decreased by moisture absorption. Components positioned at the board center were more susceptible to failure by drop shock than were corner components.