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Discrete device socket and method of fabrication therefor

Imported: 24 Feb '17 | Published: 06 Jan '04

David G. Figueroa

USPTO - Utility Patents

Abstract

An integrated circuit socket includes one or more cavities formed in a top surface of the socket, where the one or more cavities are formed in a region over which an integrated circuit can be placed. Multiple conductive contacts are attached to the socket, where each contact includes a first member that extends into one of the cavities, and a second member that provides at least part of a conductive path between the first member and the socket. The first member at least partially holds in place a discrete device inserted into the cavity. An integrated circuit package or interposer attached to the top surface over the cavity also can at least partially hold the discrete device in place. The first member makes electrical contact with the discrete device, thus completing a conductive path between the discrete device and the integrated circuit.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a cross-sectional view of an integrated circuit package, upon which a die, die side capacitors, and land side capacitors are mounted in accordance with the prior art;

FIG. 2 illustrates an electrical circuit that simulates the electrical characteristics of the capacitors illustrated in FIG. 1;

FIG. 3 illustrates a top view of a series of discrete device sockets within an integrated circuit socket in accordance with one embodiment of the present invention;

FIG. 4 illustrates a top view of an eight-terminal discrete capacitor;

FIG. 5 illustrates a top view of a two-terminal discrete capacitor;

FIG. 6 illustrates a cross-sectional view of a discrete device socket along section lines A—A of FIG. 3 in accordance with one embodiment of the present invention;

FIG. 7 illustrates a cross-sectional view of the discrete device socket shown in FIG. 6 without a capacitor inserted in the socket in accordance with one embodiment of the present invention;

FIG. 8 illustrates a cross-sectional view of a discrete device socket without a capacitor inserted in the socket in accordance with another embodiment of the present invention;

FIG. 9 illustrates a cross-sectional view of a two-terminal contact in accordance with another embodiment of the present invention;

FIG. 10 illustrates a top view of a discrete device socket in accordance with one embodiment of the present invention;

FIG. 11 illustrates a pin contact for electrically and physically connecting a discrete capacitor or other device to an integrated circuit socket in accordance with one embodiment of the present invention;

FIG. 12 illustrates a pin contact for electrically and physically connecting a discrete capacitor or other device to an integrated circuit socket in accordance with another embodiment of the present invention;

FIG. 13 illustrates a pin contact having two first members for electrically and physically connecting two discrete capacitors or other devices to an integrated circuit socket in accordance with another embodiment of the present invention;

FIG. 14 illustrates a simple contact for electrically and physically connecting a discrete capacitor or other device to an integrated circuit socket in accordance with another embodiment of the present invention;

FIG. 15 illustrates a flowchart of a method for fabricating a discrete device socket in accordance with one embodiment of the present invention;

FIGS. 16-20 are schematic cross-sections illustrating various stages of fabricating a discrete device socket using a pinned contact in accordance with one embodiment of the present invention;

FIGS. 21-23 are schematic cross-sections illustrating various stages of fabricating a discrete device socket using a simple contact in accordance with another embodiment of the present invention;

FIG. 24 illustrates an integrated circuit socket that includes one or more discrete device sockets in accordance with one embodiment of the present invention; and

FIG. 25 illustrates a general purpose computer system in accordance with one embodiment of the present invention.

Claims

1. A method for fabricating an integrated circuit socket, the method comprising:

2. The method as claimed in claim 1, wherein forming the one or more cavities comprises forming one or more holes in the socket layer.

3. The method as claimed in claim 1, wherein forming the one or more cavities comprises forming one or more depressions in the top surface of the socket layer.

4. The method as claimed in claim 1, further comprising inserting the discrete device into the cavity.

5. The method as claimed in claim 4, wherein inserting the discrete device comprises inserting a discrete capacitor into the cavity.

6. The method as claimed in claim 4, further comprising attaching the integrated circuit package to the top surface of the socket, wherein the integrated circuit package at least partially holds the discrete device in place by making contact with a surface of the discrete device.

7. A method for fabricating an integrated circuit socket, the method comprising:

8. The method as claimed in claim 7, further comprising forming a depression in the top surface of the socket layer between the cavity and the pad, wherein the bridge member is inserted into the depression when the at least one contact is attached to the pad.

9. An electrical contact for use in conjunction with an integrated circuit socket, the electrical contact comprising:

10. The electrical contact as claimed in claim 9, wherein the first member includes a flange connected to an end of the first member opposite the second member, and wherein the flange is substantially parallel to a bottom surface of the discrete device, once inserted, and the flange at least partially holds the discrete device in place by making contact with the bottom surface of the discrete device.

11. The electrical contact as claimed in claim 9, wherein the first member includes a flange that is located near a top surface of the discrete device, once inserted, and wherein the flange at least partially holds the discrete device in place by making contact with a surface of the discrete device.

12. An integrated circuit socket comprising:

13. An integrated circuit socket and package comprising:

14. The integrated circuit socket and package as claimed in claim 13, wherein the second member includes a pin that inserts into a pin hole in the socket, and a bridge member that connects the first member to the pin, and wherein connecting the contacts comprises inserting the pin into the pin hole.

15. The integrated circuit socket and package as claimed in claim 13, wherein the second member includes a bridge member connected to the first member, and wherein connecting the contacts comprises attaching the bridge member to a pad on the top surface of the socket.