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Deposition of Copper, Silver, and Nickel on Aluminum by Galvanic Replacement

Research paper by О. І. Kuntyi, H. І. Zozulya; О. Ya. Dobrovets’ka; S. А. Kornii; О. V. Reshetnyak

Indexed on: 01 Jun '18Published on: 01 Jan '18Published in: Materials Science



Abstract

We present the results of investigation of the galvanic replacement of copper, silver, and nickel on the surface of aluminum in solutions of complexes: copper from pyrophosphate solution [Cu(P2O7)2]6– ; nickel from ammoniate solution [Ni(NH3)6]2+ , and silver from ammoniate [Ag(NH3)2]+ and thiocarbamide [Ag(SC(NH2)2)2]+ solutions. It is shown that the concentration of complex ions, their stability, and the time of galvanic replacement are the main factors affecting the morphology of deposits and the geometry of metal particles. It is shown that, as the concentration of complexes in solutions decreases, their stability increases, and the duration of the process decreases, the size of particles of the reduced metal decreases from ≈ 1 μm down to ~ 300–70 nm.