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Creep of cement bonded particleboard with special reference to the influence of humidity and temperature

Research paper by C. Kondrup

Indexed on: 01 Jan '90Published on: 01 Jan '90Published in: European Journal of Wood and Wood Products



Abstract

This paper describes an investigation on creep behaviour of cement bonded particleboards loaded in bending, with special reference to the influence of humidity and temperature (tropical and temperate climatic conditions).