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Composite wiring board and manufacturing method thereof

Imported: 23 Feb '17 | Published: 22 Oct '02

Yoshio Watanabe, Toru Takebe, Mayumi Kosemura

USPTO - Utility Patents

Abstract

There is provided a composite wiring board that occupies a small space and is low in price and a manufacturing method thereof; the composite wiring board comprises at least two rigid wiring boards on end faces of which connection portions are formed, in which each of the rigid wiring boards is arranged so that each of the connection portions is situated on a plane and each of corresponding connection portions is connected with each other in the plane.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the presently preferred exemplary embodiments of the invention taken in conjunction with the accompanying drawings, in which:

FIGS. 1A-1D are side view showing conventional composite wiring boards;

FIGS. 2A-2F are first process drawings showing a part of an embodiment of a method for manufacturing a composite wiring board of the present invention;

FIGS. 3A-3F are second process drawings showing another part of the embodiment of the method for manufacturing the composite wiring board of the invention; and

FIGS. 4A and 4B are perspective views showing a further part of the embodiment of the method for manufacturing the composite wiring board of the invention.

Claims

1. A composite wiring board comprising:

2. The composite wiring board according to claim 1, wherein each of the corresponding connection portions is connected to each other with a lead wire put between them.

3. The composite wiring board according to claim 1, wherein each of the connection portions is formed by cutting a hole formed at an end of each of said rigid wiring boards.

4. The composite wiring board according to claim 3, wherein a conductive material is embedded in the hole.

5. The composite wiring board according to claim 1, wherein the end face of each of said rigid wiring boards on which each of the connection portions is formed as an inclined plane.

6. A method for manufacturing a composite wiring board in which at least two rigid wiring boards are joined, said method comprising the steps of:

7. The method according to claim 6, wherein each of the corresponding connection portions is connected to each other with a lead wire put therebetween.

8. The method according to claim 6, wherein each of the connection portions is formed by cutting a hole formed at an end of each of said rigid wiring boards so as to be connected with said wiring for connecting.

9. The method according to claim 8, wherein a conductive material is embedded in the hole.

10. The method according to claim 6, wherein the end face of each of said rigid wiring boards is formed as an inclined plane by being cut obliquely.

11. A composite wiring board comprising:

12. The composite wiring board according to claim 11, wherein:

13. The composite wiring board according to claim 11, wherein said coupling top surface is in contact with said first circuit side surface, and said coupling bottom surface is in contact with said second circuit side surface.

14. The composite wiring board according to claim 11, wherein said at least one first circuit connection portion is exposed on a face of said first circuit side surface.

15. The composite wiring board according to claim 11, wherein said at least one second circuit connection portion is exposed on a face of said second circuit side surface.

16. The composite wiring board according to claim 11, wherein said at least one first circuit connection portion is coplanar with said at least one second circuit connection portion.

17. The composite wiring board according to claim 11, wherein said first circuit board includes a first upper wire board, a first lower wire board and a first prepreg layer, said first prepreg layer being between said first upper wire board and said first lower wire board.

18. The composite wiring board according to claim 11, wherein said second circuit board includes an second upper wire board, a second lower wire board and a second prepreg layer, said second prepreg layer being between said second upper wire board and said second lower wire board.

19. The composite wiring board according to claim 11, wherein said at least one first circuit connection portion is formed from a conductive material.

20. The composite wiring board according to claim 11, wherein said at least one second circuit connection portion is formed from a conductive material.

21. The composite wiring board according to claim 11, wherein said at least one coupling connection portion is formed from a conductive material.

22. The composite wiring board according to claim 11, wherein said first circuit bottom surface opposes said second circuit top surface.

23. The composite wiring board according to claim 11, wherein said first circuit board is substantially parallel with said second circuit board.

24. The composite wiring board according to claim 11, wherein said first circuit board is parallel with said second circuit board.

25. The composite wiring board according to claim 11, wherein said at least one coupling connection portion is a plurality of coupling connection portions, said at least one first circuit connection portion is a plurality of first connection portions, and said at least one second circuit connection portion is a plurality of second connection portions.