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Circuit board for semiconductor package

Imported: 23 Feb '17 | Published: 22 Oct '02

Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee, Tae Hoan Jang, Jun Young Yang

USPTO - Utility Patents

Abstract

A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view of a circuit board for semiconductor package in accordance with a first embodiment of the present invention,

FIG. 1B is an enlarged view of part A shown in FIG. 1A, and

FIG. 1C is a cross-sectional view taken along the line I—I of FIG. 1B;

FIG. 2A is a plan view of another example of the circuit board for semiconductor package in accordance with the first embodiment of the present invention, and FIG. 2B is an enlarged view of part B shown in FIG. 2A;

FIGS. 3 and 4 are bottom views of the circuit board for semiconductor package in accordance with a second embodiment of the present invention;

FIGS. 5A,

5B,

6A and

6B are bottom and cross-sectional views of a circuit board for semiconductor package in accordance with a third embodiment of the present invention;

FIGS. 7A and 7B are plan views of a circuit board for semiconductor package in accordance with a fourth embodiment of the present invention;

FIG. 7C is a cross sectional view along line I—I of FIG.

7A.

FIG. 7D is a cross-sectional view along line II—II of FIG.

7D.

FIGS. 8A,

8B,

8C, and

8D are bottom views of a circuit board for semiconductor package in, accordance with a fifth embodiment of the present invention; and

FIGS. 9A and 9B are plan and bottom views of a circuit board for semiconductor package according to prior art, respectively.

Claims

1. A printed circuit board for a semiconductor package comprising:

2. The printed circuit board as claimed in claim 1, wherein a plurality of the circuit boards are connected in series with a slot interposed therebetween to constitute a strip.

3. The printed circuit board as claimed in claim 2, wherein the electrostatic charge removing means includes an opening region not coated with the cover coat so as to expose the circuit patterns to the exterior in the vicinity of the edge of the circuit board.

4. The printed circuit board as claimed in claim 2, wherein the electrostatic charge removing means includes a ground metal line having a defined width formed along at least one edge of the circuit board with the ball lands formed thereon and adapted to be in contact with corresponding equipment in a manufacture of the semiconductor package.

5. The printed circuit board as claimed in claim 2, wherein the electrostatic charge removing means includes a common pattern formed along the edge of the individual units on either side of the circuit board, the common patterns of the individual units being interconnected, one of the plural units having a grounding means connected to the common pattern, the grounding means being open by the cover coat.

6. The printed circuit board as claimed in claim 5, wherein the common pattern and the grounding means are formed on both sides of the resinous substrate.

7. The printed circuit board as claimed in claim 5, wherein the resinous substrate has a plurality of singulation holes in the circumference of the chip mounting region, the resinous substrate having a common pattern and a grounding means outside the singulation holes, the singulation holes being adapted for use as baseline in a singulation step during the making of the semiconductor package.

8. The printed circuit board as claimed in claim 5, wherein the grounding means includes a conductive pad formed on either side of the resinous substrate.

9. The printed circuit board as claimed in claim 8, wherein the conductive pad includes a conductive ink layer.

10. The printed circuit board as claimed in claim 5, wherein a plurality of index holes are formed at the edges of the individual units of the circuit board, and a grounding means is formed in the index holes of one of the units.

11. The printed circuit board as claimed in claim 10, wherein the grounding means includes a metal coating layer formed on an inner wall of the index holes.

12. The printed circuit board as claimed in claim 2, wherein the electrostatic charge removing means includes a printed circuit board labeling region having a conductive pad, the printed circuit board labeling region being marked in a character or symbol.

13. The printed circuit board as claimed in claim 1, wherein a plurality of the chip mounting regions are separated at a defined distance from one another and collectively arranged in rows and columns to constitute one sub strip, wherein a plurality of the sub strips are connected with a boundary of a slot having a defined length to constitute one main strips.

14. The printed circuit board as claimed in claim 13, wherein the electrostatic charge removing means includes an opening region not coated with the cover coat so as to expose the circuit patterns to the exterior in the vicinity of the edge of the circuit board.

15. The printed circuit board as claimed in claim 13, wherein the electrostatic charge removing means includes a ground metal line having a defined width formed along at least one edge of the circuit board with the ball lands formed thereon and adapted to be in contact with the corresponding equipment in a manufacture of the semiconductor package.

16. The printed circuit board as claimed in claim 13, further comprising:

17. The printed circuit board as claimed in claim 16, wherein the connecting means interconnects the adjacent ground rings in the form of an X, with four ground rings arranged at four corners of one centering ground ring.

18. The printed circuit board as claimed in claim 16, wherein the conductive pad includes a conductive ink layer.

19. The printed circuit board as claimed in claim 13, wherein the electrostatic charge removing means includes a printed circuit board labeling region having a conductive pad, the printed circuit board labeling region being marked in a character or symbol.

20. The printed circuit board as claimed in claim 1, wherein the electrostatic charge removing means includes an opening region not coated with the cover coat so as to expose the circuit patterns to the exterior in the vicinity of the edge of the circuit board.

21. The printed circuit board as claimed in claim 20, wherein a plurality of the opening regions are provided in a rectangular form at the edge of the circuit board and in the vicinity of the slot.

22. The printed circuit board as claimed in claim 20, wherein a plurality of the opening regions are provided in the form of an integrated square band along the edge of the circuit board and the vicinity of the slot.

23. The printed circuit board as claimed in claim 1, wherein the electrostatic charge removing means includes a ground metal line having a defined width formed along at least one edge of the circuit board with the ball lands formed thereon and adapted to be in contact with corresponding equipment in a manufacture of the semiconductor package.

24. The printed circuit board as claimed in claim 23, wherein the ground metal line is formed along parallel edges of the circuit board.

25. The printed circuit board as claimed in claim 23, wherein the edges of the circuit board have a plurality of index holes having a defined diameter, the index holes being metal plated and in connection with a grounding line among the circuit patterns, the index holes being disposed in the ground metal line and electrically interconnected.

26. The printed circuit board as claimed in claim 1, wherein the electrostatic charge removing means includes a printed circuit board labeling region having a conductive pad, the printed circuit board labeling region being marked in a character or symbol.

27. The printed circuit board as claimed in claim 26, wherein the conductive pad is formed on either side or both sides of the printed circuit board labeling region.

28. The printed circuit board as claimed in claim 26, wherein the character or symbol is the conductive pad.

29. The printed circuit board as claimed in claim 26, wherein the entire part of the printed circuit board labeling region other than the character or symbol is the conductive pad.

30. The printed circuit board as claimed in claim 26, wherein a gold gate formed from a conductive metal and connected to the ground is formed at one corner of the top surface of the resinous substrate, the gold gate being electrically connected to the conductive pad of the printed circuit board labeling region via a ground via hole and/or a ground circuit pattern.

31. The printed circuit board as claimed in claim 30, wherein the printed circuit board labeling region is formed on the bottom surface of the circuit board on the side of the gold gate.

32. A printed circuit board for making a semiconductor package comprising:

33. The printed circuit board as claimed in claim 32, wherein the substrate has a plurality of the outer edges, and a plurality of discrete ones of the openings are provided in the cover coat, with each opening exposing a plurality of the circuit patterns at a respective outer edge of the substrate.

34. The printed circuit board as claimed in claim 32, wherein the opening in the cover coat has the form of a ring around the substrate.

35. A printed circuit board for making a semiconductor package comprising:

36. The printed circuit board as claimed in claim 35, wherein the substrate includes a plurality of said regions in an array, with each region having an associated set of the plural circuit patterns that are electrically connected to the ground metal line.

37. The printed circuit board as claimed in claim 36, wherein the ground metal line is formed along parallel outer edges of the substrate.

38. The printed circuit board as claimed in claim 36, the substrate includes a plurality of index holes through the substrate and the ground metal line, said index holes each having a metal lining that is electrically connected to the ground metal line.

39. A strip of printed circuit boards each for making a semiconductor package comprising:

40. The printed circuit board as claimed in claim 39, wherein the substrate has opposed top and bottom surfaces, and the grounding means is on both of the top and bottom surfaces of the resinous substrate.

41. The printed circuit board as claimed in claim 39, wherein the grounding means is a conductive region disposed at an end of the strip.

42. The printed circuit board as claimed in claim 39, wherein a plurality of index holes are formed through the substrate at the edges of the individual circuit board units, said grounding means being formed in at least one of the index holes of the strip.

43. A printed circuit board for making semiconductor packages comprising:

44. The printed circuit board as claimed in claim 43, wherein four of the adjacent circuit board units are electrically connected at the corners thereof by a metal cross shaped structure.