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A peeling approach for integrated manufacturing of large mono-layer h-BN crystals

Research paper by Ruizhi Wang, David G. Purdie, Ye Fang, Fabien Massabuau, Philipp Braeuninger-Weimer, Oliver J. Burton, Raoul Blume, Robert Schloegl, Antonio Lombardo, Robert S. Weatherup, Stephan Hofmann

Indexed on: 30 Jul '18Published on: 30 Jul '18Published in: arXiv - Physics - Materials Science



Abstract

Hexagonal boron nitride (h-BN) is the only known material aside from graphite with a structure composed of simple, stable, non-corrugated atomically thin layers. While historically used as lubricant in powder form, h-BN layers have become particularly attractive as an ultimately thin insulator. Practically all emerging electronic and photonic device concepts rely on h-BN exfoliated from small bulk crystallites, which limits device dimensions and process scalability. Here, we address this integration challenge for mono-layer h-BN via a chemical vapour deposition process that enables crystal sizes exceeding 0.5 mm starting from commercial, reusable platinum foils, and in unison allows a delamination process for easy and clean layer transfer. We demonstrate sequential pick-up for the assembly of graphene/h-BN heterostructures with atomic layer precision, while minimizing interfacial contamination. Our process development builds on a systematic understanding of the underlying mechanisms. The approach can be readily combined with other layered materials and opens a scalable route to h-BN layer integration and reliable 2D material device layer stacks.